
بروزرسانی: 04 اردیبهشت 1404
Down to the Wire: Deadline for Applications is Friday, Nov. 10, for ABA TECHSHOW Startup Alley
Legal tech s،ups: Don’t miss out! Friday is the deadline to apply for a s، in the S،up Alley compe،ion at the American Bar Association’s TECHSHOW 2024, which takes place in Chicago Feb. 14-17, 2024.
Out of all the entries received, 15 s،ups will\xa0be selected to parti،te in a live pitch compe،ion that will be the opening event of this year’s TECHSHOW. In addition to the pitch compe،ion, the 15 finalists will be highlighted as exhibitors in a special S،up Alley section of the conference exhibit hall.
This is a unique opportunity to ،n exposure for your company. ABA TECHSHOW is one of the world’s pre-eminent legal technology conferences. It is attended by a large and diverse audience of legal professionals, including prac،ioners, academics, consultants and others. In addition, TECHSHOW’s audience includes legal journalists, bloggers, industry ،ysts and investors.
S،ups interested in parti،ting must\xa0complete this application form.
Applications must be received by 11:59 p.m. Pacific Time on Friday, Nov. 10, 2023.
See full compe،ion details\xa0at this post.
Don’t wait until the last minute! Get your application in today.
منبع: https://www.lawnext.com/2023/11/down-to-the-wire-deadline-for-applications-is-friday-nov-10-for-aba-techs،w-s،up-alley.html